[ad_1]
Maybe computer chips you’ll have a shortage at the moment, but the riders will continue to pull out more strength for a while, it seems.
Researchers IBM they have shown how to tighten more transistors to a chip, a feat of nanoscopic miniaturization that can significantly improve the speed and efficiency of future electronic devices.
An engineering feat could also help when the U.S. reclaims its land to invent the most advanced chips in the world, something that has become crucial in geopolitics, economic competition, and national security. Chips are increasingly essential for more products, and access to more advanced and faster chips is likely to fuel advances in critical areas. Artificial intelligence, 5G, and biotechnology.
IBM says 50 billion of the new transistors — electronic switches that allow chips to perform logical operations and store data — could fit into a chip-sized chip, two-thirds more than was possible in the previous process. The chip says it can help a phone or laptop run 45 percent faster or consume only a quarter of the power of the best previous design.
“It’s a tremendous amount of exciting technology,” he says Alamoko Jesus, an MIT professor specializing in new transistor technologies. “It’s a completely new design that drives the roadmap for the future.”
Making a new transistor is about recording the characteristics of a chip in addition to silicon, but also building on top of each other. Chip manufacturers began making three-dimensional transistors in 2009 using a design called FinFET, in which electrons pass through thin vertical fins — rather than a flat surface — to pass through transistors. IBM’s design drives this by stacking the transistors on top of each other nano-sheets which traverse a semiconductor material like layers of a cake.
Dario Gil, IBM vice president and chief research officer, says transistors have needed innovations at various stages of the manufacturing process. The work comes from IBM’s research lab in Albany, New York, where IBM collaborates with New York State University and leading chip manufacturing companies.
IBM sold the chip business in 2014, but continues to fund research into next-generation chip materials, designs, and manufacturing techniques. The company plans to make money by licensing the technology to chipmakers.
Over the decades, chip manufacturers have been working to reduce the size of components to get more performance out of chips. On a smaller scale, more components can be packaged into one chip, improving efficiency and speed, but each new generation needs tremendous engineering to improve.
Today the most advanced computer chips are made using a process that incorporates ultraviolet silicon-etched lithography (EUV) -charged features, achieving characteristics that are less than the wavelength of visible light. The process is called “7 nanometers,” though the size of the components is no longer mentioned; instead, it reflects the creation of the technology used, due to accumulated transistors and other changes in chip manufacturing. The new IBM chip is three generations ahead, using a 2-nanometer duplicate process.
IBM first proven transistors did just that In 2017 on the scale of 5 nanometer processes. It shows the challenge of mastering the techniques involved in taking four years to go 2 nanometers. The most advanced chip companies in the world have started making 5-nanometer chips, using existing approaches, which seem to be close to the limits.
Dan Hutcheson, CEO VLSI Researchbusiness analysts say new manufacturing tricks are definitely needed to manufacture 3D components. But “they’ve done the hardest. It’s a real milestone for the industry, ”he says, and the performance improvements proposed by IBM appear to be conservative.
The advances in chip manufacturing were the most famous Moor’s law, A rule named after Intel co-founder Gordon Moore that says the number of transistors on a chip will double every two years or so. Technologists are afraid of it The end of Moore’s law for a decade or more, while chip makers pushed the boundaries of new manufacturing technology and electronic effects.
[ad_2]
Source link
